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Lead Frame

Profiled Strip or Contact

Thermal Bimetal Material

Coprester Steel

Copper-Nickel（Cu/Ni) Composite Strip

Aluminum-Steel Composite Strip

Silver-Palladium Composite Thin Strip Material

Wear-resistant Sintered Carbide Ball

Carbide Sealing Ring

Carbide Winding Needle

High Precision Rolled Copper Foil

SOP、SSOP、TSSOP、QFP、QFN、DFN High-density, ultra-thin etched lead frame

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How Flute Design Impacts Rotary File Burr Performance in Precision Grinding and Deburring Work Jun 12, 2025
Inside the Precision Manufacturing Process of Tungsten Carbide Spheres for Demanding Applications Jun 06, 2025
Understanding the Key Differences Between Rolled Copper Foil and ED Copper Foil in PCB Manufacturing May 26, 2025

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Company News Apr 12, 2025

Hongfeng Collaborates with Wenzhou University on Themed Party Day Activity to Boost Industry-Academia Integration

April 12, 2025 • Wenzhou, China – Wenzhou Hongfeng (SZSE: 300283), a provider of advanced electrical...

Jun 12, 2025
How Flute Design Impacts Rotary File Burr Performance in Precision Grinding and Deburring Work

In the world of metalworking and precision finishing, the design of a rotary file burr is more than just an aesthetic or structural detail—it’s a key determinant of performance, efficiency, and longev...

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Jun 06, 2025
Inside the Precision Manufacturing Process of Tungsten Carbide Spheres for Demanding Applications

From aerospace to oilfield equipment, the demand for high-performance components has driven the continued evolution of tungsten carbide spheres. These precision-engineered balls play a critical role i...

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May 26, 2025
Understanding the Key Differences Between Rolled Copper Foil and ED Copper Foil in PCB Manufacturing

Rolled copper foil and electrodeposited (ED) copper foil are two primary forms used in printed circuit board (PCB) manufacturing, each with distinct characteristics that influence performance and appl...

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May 22, 2025
The Precision Behind Laser Cutting Nozzles: How Design Impacts Performance

At the heart of every high-quality laser cutting system lies a small but vital component—the laser cutting nozzle . While often overlooked, this part plays a decisive role in determining cut accuracy,...

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May 14, 2025
The Evolution of IC Lead Frame Technology and Its Impact on Semiconductor Packaging

The journey of the IC lead frame has mirrored the rapid advancement of semiconductor packaging technologies over the past few decades. From the early days of through-hole mounting with dual in-line pa...

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May 09, 2025
Carbide Mould vs Steel Mould – Choosing the Right Tool for Precision Manufacturing

Selecting between a carbide mould and a steel mould is a critical decision that directly impacts production efficiency, part quality, and long-term operational costs. Both materials are widely used in...

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