Lead Frame Manufacturers

Lead frame, as a chip carrier for integrated circuits, is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve an electrical connection between the internal circuit leads of the chip and external leads, forming an electrical circuit. It plays a bridge role in connecting with external wires. Most semiconductor integrated blocks require the use of lead frames, which are important basic materials in the electronic information industry. We have independently developed large-sized, high-density, ultra-thin etching lead frames, with surface treatment of the substrate including micro-etching, electroplating roughening, and brown oxidation, to meet the high-reliability requirements of current and future products in the industry. The reliability level can reach MSL.1, and the product application area is more extensive. As a carrier of chips, IC lead frames are widely used in the 4C industry, including computers and computer peripheral products, telephones, televisions, PCM, optical transceivers, servers, monitoring facilities, automotive electronics, consumer electronics, etc. The update and iteration speed is fast, and the current market demand is increasing year by year.

A lead frame, serving as a fundamental component for integrated circuits (ICs), plays a pivotal role in facilitating electrical connections between the internal circuit leads of a chip and external leads. This interconnection is achieved using various bonding materials such as gold wire, aluminum wire, and copper wire, thereby forming a seamless electrical circuit. Essentially, the lead frame acts as a bridge, linking the internal circuitry with external wires and enabling the functionality of the IC.
In the realm of the electronic information industry, lead frames are indispensable as they serve as chip carriers for most semiconductor-integrated blocks. Recognizing their significance, our independent endeavors have led to the development of large-sized, high-density, and ultra-thin etching lead frames. These innovations incorporate advanced surface treatments on the substrate, including micro-etching, electroplating roughening, and brown oxidation. Such treatments ensure that our lead frames meet the high-reliability standards demanded by current and future products within the industry. Notably, our lead frames achieve a reliability level of MSL.1, expanding the application areas of our products across various industries.
As carriers for chips, IC lead frames find extensive use in the 4C industry, encompassing computers, computer peripherals, telephones, televisions, PCM (pulse-code modulation), optical transceivers, servers, monitoring facilities, automotive electronics, and consumer electronics. The fast-paced evolution of technology drives the constant update and iteration of IC lead frames. As a testament to their importance, the current market demand for these components continues to escalate annually.

Our leadership in the lead frame sector stems from a deep understanding of the ever-evolving needs of the electronic industry. Positioned as a customized manufacturer, we focus on providing tailored solutions that address specific client requirements, offering a high degree of flexibility and precision in every product we deliver. Our expertise is not just in the design and fabrication of lead frames, but also in the ability to scale production to meet the varied demands of industries worldwide. As a dedicated factory and manufacturer, we control every aspect of the production process, from material sourcing to the final quality checks, ensuring the highest standards of performance and reliability.